| Publication type: | Conference poster |
| Type of review: | Not specified |
| Title: | STPA pictured |
| Authors: | Rejzek, Martin |
| Conference details: | 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014 |
| Issue Date: | 2014 |
| Language: | English |
| Subject (DDC): | 363: Environmental and security problems 620: Engineering |
| URI: | https://digitalcollection.zhaw.ch/handle/11475/16829 |
| Fulltext version: | Published version |
| License (according to publishing contract): | Licence according to publishing contract |
| Departement: | School of Engineering |
| Organisational Unit: | Institute of Applied Mathematics and Physics (IAMP) |
| Appears in collections: | Publikationen School of Engineering |
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Rejzek, M. (2014). STPA pictured. 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
Rejzek, M. (2014) ‘STPA pictured’, in 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
M. Rejzek, “STPA pictured,” in 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014, 2014.
REJZEK, Martin, 2014. STPA pictured. In: 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014. Conference poster. 2014
Rejzek, Martin. 2014. “STPA Pictured.” Conference poster. In 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
Rejzek, Martin. “STPA Pictured.” 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014, 2014.
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