1. ZHAW digitalcollection
  2. Life Sciences und Facility Management
  3. Publikationen
  4. Publikationen Life Sciences und Facility Management
Full metadata record
DC FieldValueLanguage
dc.contributor.authorOelßner, W.-
dc.contributor.authorZosel, J.-
dc.contributor.authorGuth, U.-
dc.contributor.authorPechstein, T.-
dc.contributor.authorBabel, W.-
dc.contributor.authorConnery, J.G.-
dc.contributor.authorDemuth, Caspar-
dc.contributor.authorGrote Gansey, M.-
dc.contributor.authorVerburg, J.B.-
dc.date.accessioned2018-08-24T09:34:29Z-
dc.date.available2018-08-24T09:34:29Z-
dc.date.issued2005-
dc.identifier.issn0925-4005de_CH
dc.identifier.urihttps://digitalcollection.zhaw.ch/handle/11475/9586-
dc.description.abstractThe encapsulation of ISFET sensor chips is a challenge to sensor technology and materials. Recently developed new packaging technologies enable reliable and cost effective chip encapsulation. By this, one of the serious problems, which had hindered the large-scale production and industrial application of ISFET sensors over three decades could be overcome now to a large extent. The paper reports both on ISFET encapsulation methods on laboratory level and advanced industrial production technologies. The influence of the packaging design on special applications and on the dynamic behaviour of the sensor is illustrated. Furthermore, sensor materials are characterised and various testing methods are described.de_CH
dc.language.isoende_CH
dc.publisherElsevierde_CH
dc.relation.ispartofSensors and Actuators B: Chemicalde_CH
dc.rightsLicence according to publishing contractde_CH
dc.subject.ddc540: Chemiede_CH
dc.titleEncapsulation of ISFET sensor chipsde_CH
dc.typeBeitrag in wissenschaftlicher Zeitschriftde_CH
dcterms.typeTextde_CH
zhaw.departementLife Sciences und Facility Managementde_CH
zhaw.organisationalunitInstitut für Chemie und Biotechnologie (ICBT)de_CH
dc.identifier.doi10.1016/j.snb.2004.05.009de_CH
zhaw.funding.euNode_CH
zhaw.issue1de_CH
zhaw.originated.zhawNode_CH
zhaw.pages.end117de_CH
zhaw.pages.start104de_CH
zhaw.publication.statuspublishedVersionde_CH
zhaw.volume105de_CH
zhaw.publication.reviewPeer review (Publikation)de_CH
Appears in collections:Publikationen Life Sciences und Facility Management

Files in This Item:
There are no files associated with this item.
Show simple item record
Oelßner, W., Zosel, J., Guth, U., Pechstein, T., Babel, W., Connery, J. G., Demuth, C., Grote Gansey, M., & Verburg, J. B. (2005). Encapsulation of ISFET sensor chips. Sensors and Actuators B: Chemical, 105(1), 104–117. https://doi.org/10.1016/j.snb.2004.05.009
Oelßner, W. et al. (2005) ‘Encapsulation of ISFET sensor chips’, Sensors and Actuators B: Chemical, 105(1), pp. 104–117. Available at: https://doi.org/10.1016/j.snb.2004.05.009.
W. Oelßner et al., “Encapsulation of ISFET sensor chips,” Sensors and Actuators B: Chemical, vol. 105, no. 1, pp. 104–117, 2005, doi: 10.1016/j.snb.2004.05.009.
OELSSNER, W., J. ZOSEL, U. GUTH, T. PECHSTEIN, W. BABEL, J.G. CONNERY, Caspar DEMUTH, M. GROTE GANSEY und J.B. VERBURG, 2005. Encapsulation of ISFET sensor chips. Sensors and Actuators B: Chemical. 2005. Bd. 105, Nr. 1, S. 104–117. DOI 10.1016/j.snb.2004.05.009
Oelßner, W., J. Zosel, U. Guth, T. Pechstein, W. Babel, J.G. Connery, Caspar Demuth, M. Grote Gansey, and J.B. Verburg. 2005. “Encapsulation of ISFET Sensor Chips.” Sensors and Actuators B: Chemical 105 (1): 104–17. https://doi.org/10.1016/j.snb.2004.05.009.
Oelßner, W., et al. “Encapsulation of ISFET Sensor Chips.” Sensors and Actuators B: Chemical, vol. 105, no. 1, 2005, pp. 104–17, https://doi.org/10.1016/j.snb.2004.05.009.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.