1. ZHAW digitalcollection
  2. School of Engineering
  3. Publikationen
  4. Publikationen School of Engineering
Full metadata record
DC FieldValueLanguage
dc.contributor.authorRejzek, Martin-
dc.date.accessioned2019-04-24T09:46:58Z-
dc.date.available2019-04-24T09:46:58Z-
dc.date.issued2014-
dc.identifier.urihttps://digitalcollection.zhaw.ch/handle/11475/16829-
dc.language.isoende_CH
dc.rightsLicence according to publishing contractde_CH
dc.subject.ddc363: Umwelt- und Sicherheitsproblemede_CH
dc.subject.ddc620: Ingenieurwesende_CH
dc.titleSTPA picturedde_CH
dc.typeKonferenz: Posterde_CH
dcterms.typeTextde_CH
zhaw.departementSchool of Engineeringde_CH
zhaw.organisationalunitInstitut für Angewandte Mathematik und Physik (IAMP)de_CH
zhaw.conference.details3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014de_CH
zhaw.funding.euNode_CH
zhaw.originated.zhawYesde_CH
zhaw.publication.statuspublishedVersionde_CH
zhaw.publication.reviewNot specifiedde_CH
Appears in collections:Publikationen School of Engineering

Files in This Item:
There are no files associated with this item.
Show simple item record
Rejzek, M. (2014). STPA pictured. 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
Rejzek, M. (2014) ‘STPA pictured’, in 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
M. Rejzek, “STPA pictured,” in 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014, 2014.
REJZEK, Martin, 2014. STPA pictured. In: 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014. Conference poster. 2014
Rejzek, Martin. 2014. “STPA Pictured.” Conference poster. In 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
Rejzek, Martin. “STPA Pictured.” 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014, 2014.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.