Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demand

Günther, Roman; Caseri, Walter; Brändli, Christof

doi:10.3390/polym14235142

Please use this identifier to cite or link to this item: https://doi.org/10.21256/zhaw-26264

Publication type:	Article in scientific journal
Type of review:	Peer review (publication)
Title:	Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demand
Authors:	Günther, Roman Caseri, Walter Brändli, Christof
et. al:	No
DOI:	10.3390/polym14235142 10.21256/zhaw-26264
Published in:	Polymers
Volume(Issue):	14
Issue:	23
Page(s):	5142
Issue Date:	25-Nov-2022
Publisher / Ed. Institution:	MDPI
ISSN:	2073-4360
Language:	English
Subjects:	Debonding on demand; Direct bonding; Surface modification
Subject (DDC):	660: Chemical engineering
Abstract:	Recycling adhesively bonded polymers is inconvenient due to its expensive separation and removal of adhesive residues. To tackle this problem, adhesive technologies are needed allowing debonding on demand and which do not contaminate the surface of the substrate. Direct bonding enabled by oxygen plasma treatment has already achieved substantial adhesion between flat substrates. However, debonding takes place by water, thus limiting the applications of this technology to water-free environments. The work presented in the following shows that this drawback can be overcome by grafting acrylic acid and adding copper(II) ions on the surface of polystyrene. In this process, the number of functional groups on the surface was significantly increased without increasing the surface roughness. The bonding strength between the substrates could be increased, and the process temperature could be lowered. Nevertheless, the samples could be debonded by exposure to EDTA solution under ultrasound. Hence, by combining acrylic acid grafting, variations in the bonding temperatures and the use of copper(II) ions, the bonding strength (5 N to >85 N) and the debonding time under the action of water can be tuned over large ranges (seconds to complete resistance).
URI:	https://digitalcollection.zhaw.ch/handle/11475/26264
Fulltext version:	Published version
License (according to publishing contract):	CC BY 4.0: Attribution 4.0 International
Departement:	School of Engineering
Organisational Unit:	Institute of Materials and Process Engineering (IMPE)
Appears in collections:	Publikationen School of Engineering

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Günther, R., Caseri, W., & Brändli, C. (2022). Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demand. Polymers, 14(23), 5142. https://doi.org/10.3390/polym14235142

Günther, R., Caseri, W. and Brändli, C. (2022) ‘Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demand’, Polymers, 14(23), p. 5142. Available at: https://doi.org/10.3390/polym14235142.

R. Günther, W. Caseri, and C. Brändli, “Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demand,” Polymers, vol. 14, no. 23, p. 5142, Nov. 2022, doi: 10.3390/polym14235142.

GÜNTHER, Roman, Walter CASERI und Christof BRÄNDLI, 2022. Copper ions absorbed on acrylic-acid-grafted polystyrene enable direct bonding with tunable bonding strength and debonding on demand. Polymers. 25 November 2022. Bd. 14, Nr. 23, S. 5142. DOI 10.3390/polym14235142

Günther, Roman, Walter Caseri, and Christof Brändli. 2022. “Copper Ions Absorbed on Acrylic-Acid-Grafted Polystyrene Enable Direct Bonding with Tunable Bonding Strength and Debonding on Demand.” Polymers 14 (23): 5142. https://doi.org/10.3390/polym14235142.

Günther, Roman, et al. “Copper Ions Absorbed on Acrylic-Acid-Grafted Polystyrene Enable Direct Bonding with Tunable Bonding Strength and Debonding on Demand.” Polymers, vol. 14, no. 23, Nov. 2022, p. 5142, https://doi.org/10.3390/polym14235142.