Publication type: Article in scientific journal
Type of review: Peer review (publication)
Title: Encapsulation of ISFET sensor chips
Authors: Oelßner, W.
Zosel, J.
Guth, U.
Pechstein, T.
Babel, W.
Connery, J.G.
Demuth, Caspar
Grote Gansey, M.
Verburg, J.B.
DOI: 10.1016/j.snb.2004.05.009
Published in: Sensors and Actuators B: Chemical
Volume(Issue): 105
Issue: 1
Page(s): 104
Pages to: 117
Issue Date: 2005
Publisher / Ed. Institution: Elsevier
ISSN: 0925-4005
Language: English
Subject (DDC): 540: Chemistry
Abstract: The encapsulation of ISFET sensor chips is a challenge to sensor technology and materials. Recently developed new packaging technologies enable reliable and cost effective chip encapsulation. By this, one of the serious problems, which had hindered the large-scale production and industrial application of ISFET sensors over three decades could be overcome now to a large extent. The paper reports both on ISFET encapsulation methods on laboratory level and advanced industrial production technologies. The influence of the packaging design on special applications and on the dynamic behaviour of the sensor is illustrated. Furthermore, sensor materials are characterised and various testing methods are described.
Fulltext version: Published version
License (according to publishing contract): Licence according to publishing contract
Departement: Life Sciences and Facility Management
Organisational Unit: Institute of Chemistry and Biotechnology (ICBT)
Appears in collections:Publikationen Life Sciences und Facility Management

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